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GENTRON SEMICONDUCTOR BURN-IN OVEN GT-2100-16

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GENTRON SEMICONDUCTOR BURN-IN OVEN (GT-2100-16)

Application:

The Semiconductor Burn-In Oven is designed for accelerated stress testing to identify early-life failures and ensure long-term reliability of semiconductor devices. By subjecting components to controlled thermal stress conditions, latent defects can be detected prior to deployment, reducing the risk of in-field failures.

Engineered with advanced thermal management systems, the oven ensures precise temperature control, uniform heat distribution, and reliable heat dissipation to prevent localized overheating and guarantee consistent test conditions across all devices under test (DUTs).

Category

Thermal Processing Technology

Project Features

1

Chamber Volume: 7 to 21 cubic feet

2

Operating Temperature Range: Ambient to +210 °C

3

Heat Dissipation Capacity: 5 kW at 125 °C

4

Temperature Uniformity: +3 °C (measured without load at 125 °C)

5

Temperature Control Accuracy: +0.5 °C

6

Automation: Integrated system for automatic Burn-In Board (BIB) loading and unloading


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